Indium Corporation's Karthik Vijay, technical manager for Europe, Africa, and the Middle East, will present at the International Microelectronics Assembly and Packaging Society (IMAPS) RaMP RF and Microwave Packaging Conference April 15-16 in Leeds, UK.
Karthik's presentation, Void Reduction & Better Thermal Management with Engineered Flux-Coated Solder Preforms, discusses the important attributes of flux-coating formulations and coating quality. Attributes include using a uniform flux-coating to reduce oxidation and minimize voids, using low-outgassing and low-voiding halogen-free flux coatings with a unique oxidation barrier to reduce oxidation and achieve equal/better wetting, and engineering the flux-coating rheology to facilitate tape & reel packaging for high-volume automation.
Karthik is based in the UK and manages Indium Corporation's technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Karthik is active in several industry organizations, including IMAPS and the Surface Mount Technology Association (SMTA), and has presented at industry forums and conferences internationally. He earned his master's degree in systems science and industrial engineering from Binghamton University, State University of New York.
IMAPS is a global community of microelectronic related engineers, scientists, manufacturers, end-users, and supply chain companies. The Society aims to support the development and growth of the microelectronics and related industries, and to aid the transfer of knowledge and information.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
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