Indium Corporation's Karthik Vijay, technical manager for Europe, Africa, and the Middle East, will present at the International Microelectronics Assembly and Packaging Society (IMAPS) RaMP RF and Microwave Packaging Conference April 15-16 in Leeds, UK.
Karthik's presentation, Void Reduction & Better Thermal Management with Engineered Flux-Coated Solder Preforms, discusses the important attributes of flux-coating formulations and coating quality. Attributes include using a uniform flux-coating to reduce oxidation and minimize voids, using low-outgassing and low-voiding halogen-free flux coatings with a unique oxidation barrier to reduce oxidation and achieve equal/better wetting, and engineering the flux-coating rheology to facilitate tape & reel packaging for high-volume automation.
Karthik is based in the UK and manages Indium Corporation's technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Karthik is active in several industry organizations, including IMAPS and the Surface Mount Technology Association (SMTA), and has presented at industry forums and conferences internationally. He earned his master's degree in systems science and industrial engineering from Binghamton University, State University of New York.
IMAPS is a global community of microelectronic related engineers, scientists, manufacturers, end-users, and supply chain companies. The Society aims to support the development and growth of the microelectronics and related industries, and to aid the transfer of knowledge and information.
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持体系，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
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