Shrinking stencil apertures and gaps between pads have necessitated more critical solder paste printing requirements. Indium Corporation expert Leo Hu, senior area technical manager, will cover these conditions and more when he presents on fine feature solder paste printing for heterogeneous integration assembly at SiP Conference China, Sept. 27-29, Shenzhen, China.
Increased functionality, higher performance, faster time to market, lower cost, and increasing miniaturization requirements on SiP passives are the driving forces behind the adoption of heterogeneous integration. As stencil apertures shrink below 90m and gaps between pads fall below 50m, this solution allows more chips to be integrated into a single package under very tight conditions.
In Applications of Fine Feature Solder Paste Printing for Heterogeneous Integration Assembly, Hu will cover Type 6 and Type 7 ultrafine pitch solder paste printing; share SPI data addressing different area ratios that explains the influence of powder size, flux vehicle vs. area ratio, and printing performance; and discuss the application of water-soluble paste. Hell also discuss a related case study and Indium Corporations new offeringSiPaste C201HF, a cleanable paste designed to accommodate fine feature printing.
Hu joined Indium Corporation in 2016 and is based in Suzhou, China. He has nearly 15 years of experience in semiconductor packaging and is a veteran in advanced assembly technology development, process improvement, and assembly materials applications. Hu has served in many roles at industry-leading outsourced assembly and test (OSAT) companies, including process engineer, project engineer, senior R&D engineer, and chief engineer. He has a masters degree in IC engineering from the Chinese Academy of Science, and a bachelors degree in electronic information science and technology from Nankai University, Tianjin, China.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以透過www.linkedin.com/company/indium-corporation/或@IndiumCorp 追蹤我們的專家，From One Engineer To Another (#FOETA)。
About SiP Conference China
SiP Conference China will highlight new advancements in SiP technologies that are helping to implement reduced-size and cost-effective solutions for high data rate wireless 5G technology to cover a wide spectrum of applications, including 5G-NR cellular, IoT, autonomous vehicles, artificial intelligence (AI), data storage, computing, and networking.
SiP Conference China is widely regarded as the most prominent SiP conference in China. This highly informative annual gathering offers the best in electronic system design and SiP packaging expertise from all aspects of the design and supply chain, including assembly and test from OSATs, EMS, OEMs, IDM, and fabless semiconductor companies and silicon foundries, as well as material and equipment suppliers.
