Indium Corporation‘s leading technical experts are set to deliver and participate in a number of presentations and panel discussions throughout IPC APEX Expo, April 9-11, in Anaheim, Calif., U.S. Topics will include sustainability, assembly processes, and EV electronics.
Tuesday, Apr. 9
- Innovative Low-Temperature Solder Alloy & Optimized Convection Reflow Oven Combination to Achieve up to 25% Energy Savings presented by Regional Technical Manager and Technologist Advanced Applications Andreas Karch, in partnership with Daniel Hamann, SMT Thermal Discoveries
Wednesday, Apr. 10
- Advancements in Solder Paste Printing: Cleaning Compatibility Assessment of Jettable and Screen-Printable Pastes for Complex Electronics Assemblies presented by Product Specialist Evan Griffith, in partnership with Kalyan Nukala, Zestron Americas
- Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing presented by Product Development Specialist for Thermal Interface Materials Milo Lazi, in partnership with Sunny Agarwal, ITWEAE
- The Attempt of Lower Temperature Soldering Process for Large Plastic Ball Grid Array Board-Level Assembly presented by R&D Manager, Alloy Group, Principal Metallurgist Dr. HongWen Zhang
- Optimization of Photonic Soldering Processes for SIR Performance co-authored by Technical Support Engineer Thuy Nguyen, presented by Ara Parsekian, PulseForge, Inc.
- Liquid Metal Patterning for Electronic Circuits and Thermal Management co-authored by Milo Lazi, Associate Director ESM Product Management Jon Major, and Material Research Scientist Dr. Ricky McDonough; presented by Michael Dickey, North Carolina State University
Thursday, Apr. 11
- Panel Discussion: PCBA Reliability and Test for EV Applications featuring Principal Engineer, Global Accounts Technical Manager, Dave Sbiroli
Click here for an interactive schedule of all presentations taking place at IPC APEX 2024 and be sure to visit with Indium Corporation’s experts at booth 4227.
Andreas has more than 20 years of experience in automotive electronics and power electronics, including the development of advanced customized solutions. In 2014, the Austrian Patent Office awarded him the “Inventum” award for his patent for innovative LED automotive lighting as one of the top ten applicants. He is an ECQA-certified development engineer and has earned the Six Sigma Yellow Belt.
Griffith is a Product Specialist for Indium Corporation’s Semiconductor and Advanced Assembly Materials product line, which includes Indium Corporation’s fine-powder solder pastes (SiPastes) and semiconductor assembly fluxes. He is responsible for researching and analyzing customer and market data and facilitating current and prospective customers’ needs. Additionally, he supports customers’ inquiries, internal product trainings, and works closely with Indium Corporation’s R&D team on new applications. He earned a Master of Engineering Management, Bachelor of Engineering in Materials Science and Engineering, and a Bachelor of Arts in Engineering Sciences and French, graduating with honors, all from the Thayer School of Engineering at Dartmouth College. He has also earned his Lean Six Sigma Green Belt from Dartmouth College and has received certifications in Product Management from Columbia University and Product Marketing from Cornell University.
Lazi 負責開發新的熱能材料和產品，並針對客戶的挑戰和應用提供解決方案。他還負責開發新的測試方法來評估電源和熱能產品，並收集新產品和現有產品的資料用於行銷簡報。他擁有塞爾維亞 Nis 大學的電子工程碩士學位和電機工程學士學位。他是貝爾格萊德塞爾維亞工程師商會認證的能源效率工程師；認證的 SMT 製程工程師；能說流利的英語、塞爾維亞語、克羅地亞語和波斯尼亞語。
As manager of the alloy group in Indium Corporation’s R&D department, Dr. Zhang’s focus is on the development of the varieties of Pb-free solder materials and the associated technologies for low-temperature, high-temperature, and/or high-reliability applications. He was instrumental in inventing the Durafuse technology to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding surface, and control the joint’s morphology, thus improving reliability. As principal metallurgist, he is also responsible for expanding metallurgical innovation. He and his team are responsible for using metallurgical insight to develop new products, implement improvements to existing processes and products, and measure results. Dr. Zhang has a bachelor’s degree in metallurgical physical chemistry, a master’s degree in mechanical engineering, and a Ph.D. in materials science and engineering. He has a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, and is a certified IPC Specialist for IPC-A-600 and IPC-A-610, as well as a certified SMT Process Engineer. Dr. Zhang has published two book chapters and more than 50 conference and journal papers, and he has been granted more than ten patents in the U.S. and globally. Dr. Zhang was awarded the Surface Mount Technology Association’s (SMTA) Technical Distinction Award in 2023.
Nguyen joined Indium Corporation in 2015 and has held roles in Quality, R&D, and Manufacturing during her time with the company. She has contributed to multiple large-scale projects and assisted in the implementation of new processes and training materials. She holds a bachelor’s degree in chemistry from Utica College and is a Certified SMT Process Engineer (CSMTPE).
As Principal Engineer, Sbiroli utilizes his experience to characterize soldering materials’ critical performance attributes and assist in the development of new materials and accelerated test methods to augment their critical performance. As the Technical Manager of Global Accounts, he is also responsible for the coordination, business maintenance, and resource deployment of technical services and onsite support to Indium Corporation’s global customer base with a focus on key automotive customers. Sbiroli has more than 25 years of hands-on experience in the selection and applications of printed circuit board assembly materials and SMT process optimization, defect reduction, and troubleshooting on hundreds of Indium Corporation customers’ SMT and electronic assembly production lines. He has a bachelor’s degree in Mechanical Engineering Technology from the State University of New York Institute of Technology. He achieved one of the highest scores on the SMTA Process Engineer certification exam and is certified as an IPC Specialist for IPC-A-600 and IPC-A-610D. He actively participates in the development of industry standards with the IPC and received the IPC’s Distinguished Committee Service award for his work on the J-STD-004B (Requirements for Soldering Fluxes) standards.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以在www.linkedin.com/company/indium-corporation/ 追蹤我們的專家，From One Engineer To Another (#FOETA)。
