Indium Corporation‘s leading technical experts are set to deliver and participate in a number of presentations and panel discussions throughout IPC APEX Expo, April 9-11, in Anaheim, Calif., U.S. Topics will include sustainability, assembly processes, and EV electronics.
Tuesday, Apr. 9
- Innovative Low-Temperature Solder Alloy & Optimized Convection Reflow Oven Combination to Achieve up to 25% Energy Savings presented by Regional Technical Manager and Technologist Advanced Applications Andreas Karch, in partnership with Daniel Hamann, SMT Thermal Discoveries
Wednesday, Apr. 10
- Advancements in Solder Paste Printing: Cleaning Compatibility Assessment of Jettable and Screen-Printable Pastes for Complex Electronics Assemblies presented by Product Specialist Evan Griffith, in partnership with Kalyan Nukala, Zestron Americas
- Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing presented by Product Development Specialist for Thermal Interface Materials Milo Lazi, in partnership with Sunny Agarwal, ITWEAE
- The Attempt of Lower Temperature Soldering Process for Large Plastic Ball Grid Array Board-Level Assembly presented by R&D Manager, Alloy Group, Principal Metallurgist Dr. HongWen Zhang
- Optimization of Photonic Soldering Processes for SIR Performance co-authored by Technical Support Engineer Thuy Nguyen, presented by Ara Parsekian, PulseForge, Inc.
- Liquid Metal Patterning for Electronic Circuits and Thermal Management co-authored by Milo Lazi, Associate Director ESM Product Management Jon Major, and Material Research Scientist Dr. Ricky McDonough; presented by Michael Dickey, North Carolina State University
Thursday, Apr. 11
- Panel Discussion: PCBA Reliability and Test for EV Applications featuring Principal Engineer, Global Accounts Technical Manager, Dave Sbiroli
Click here for an interactive schedule of all presentations taking place at IPC APEX 2024 and be sure to visit with Indium Corporation’s experts at booth 4227.
Andreas has more than 20 years of experience in automotive electronics and power electronics, including the development of advanced customized solutions. In 2014, the Austrian Patent Office awarded him the “Inventum” award for his patent for innovative LED automotive lighting as one of the top ten applicants. He is an ECQA-certified development engineer and has earned the Six Sigma Yellow Belt.
Griffith is a Product Specialist for Indium Corporation’s Semiconductor and Advanced Assembly Materials product line, which includes Indium Corporation’s fine-powder solder pastes (SiPastes) and semiconductor assembly fluxes. He is responsible for researching and analyzing customer and market data and facilitating current and prospective customers’ needs. Additionally, he supports customers’ inquiries, internal product trainings, and works closely with Indium Corporation’s R&D team on new applications. He earned a Master of Engineering Management, Bachelor of Engineering in Materials Science and Engineering, and a Bachelor of Arts in Engineering Sciences and French, graduating with honors, all from the Thayer School of Engineering at Dartmouth College. He has also earned his Lean Six Sigma Green Belt from Dartmouth College and has received certifications in Product Management from Columbia University and Product Marketing from Cornell University.
ラジは、新しい熱材料や熱製品の開発、顧客の課題や用途に対するソリューションの提供を担当している。また、パワーおよびサーマル製品を評価するための新しい試験方法を開発し、マーケティングプレゼンテーションのために新製品および既存製品のデータを収集している。セルビアのニス大学で電子工学の修士号と電気工学の学士号を取得。ベオグラードのセルビア技術者会議所認定エネルギー効率エンジニア、認定SMTプロセスエンジニアであり、英語、セルビア語、クロアチア語、ボスニア語に堪能である。
As manager of the alloy group in Indium Corporation’s R&D department, Dr. Zhang’s focus is on the development of the varieties of Pb-free solder materials and the associated technologies for low-temperature, high-temperature, and/or high-reliability applications. He was instrumental in inventing the Durafuse technology to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding surface, and control the joint’s morphology, thus improving reliability. As principal metallurgist, he is also responsible for expanding metallurgical innovation. He and his team are responsible for using metallurgical insight to develop new products, implement improvements to existing processes and products, and measure results. Dr. Zhang has a bachelor’s degree in metallurgical physical chemistry, a master’s degree in mechanical engineering, and a Ph.D. in materials science and engineering. He has a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, and is a certified IPC Specialist for IPC-A-600 and IPC-A-610, as well as a certified SMT Process Engineer. Dr. Zhang has published two book chapters and more than 50 conference and journal papers, and he has been granted more than ten patents in the U.S. and globally. Dr. Zhang was awarded the Surface Mount Technology Association’s (SMTA) Technical Distinction Award in 2023.
Nguyen joined Indium Corporation in 2015 and has held roles in Quality, R&D, and Manufacturing during her time with the company. She has contributed to multiple large-scale projects and assisted in the implementation of new processes and training materials. She holds a bachelor’s degree in chemistry from Utica College and is a Certified SMT Process Engineer (CSMTPE).
As Principal Engineer, Sbiroli utilizes his experience to characterize soldering materials’ critical performance attributes and assist in the development of new materials and accelerated test methods to augment their critical performance. As the Technical Manager of Global Accounts, he is also responsible for the coordination, business maintenance, and resource deployment of technical services and onsite support to Indium Corporation’s global customer base with a focus on key automotive customers. Sbiroli has more than 25 years of hands-on experience in the selection and applications of printed circuit board assembly materials and SMT process optimization, defect reduction, and troubleshooting on hundreds of Indium Corporation customers’ SMT and electronic assembly production lines. He has a bachelor’s degree in Mechanical Engineering Technology from the State University of New York Institute of Technology. He achieved one of the highest scores on the SMTA Process Engineer certification exam and is certified as an IPC Specialist for IPC-A-600 and IPC-A-610D. He actively participates in the development of industry standards with the IPC and received the IPC’s Distinguished Committee Service award for his work on the J-STD-004B (Requirements for Soldering Fluxes) standards.
インジウム・コーポレーションについて
インジウム・コーポレーション は、世界のエレクトロニクス、半導体、薄膜、サーマルマネージメント市場向けの一流の材料精製、製錬、製造、サプライヤーである。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil などがある。1934年に設立され、グローバルな技術サポートと中国、ドイツ、インド、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
インジウム・コーポレーションについての詳細は、www.indium.comをご覧いただくか、Jingya HuangまでEメールにてお問い合わせください。また、当社の専門家、From One Engineer To Another (#FOETA)をフォローすることもできます。www.linkedin.com/company/indium-corporation/。
