Indium Corporation experts will present their technical findings at the IMAPS 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging May 22-23, in Dearborn, MI.
Global Product Manager: Semiconductor and Advanced Assembly Materials Andy C. Mackie, PhD, MSc, will chair the paper session on die attach.
Senior Technical Support Engineer Mario Scalzo will present IGBT’s from the Top Down; Electrical & Thermal Connectivity from Die Attach to Heat Sink, which discusses the way solders perform in the stack up, from die attach to heat sink, focusing on thermal transfer value and reliability data.
Andy has more than 20 years of experience in new product and process development and materials marketing in all areas of electronics manufacturing, including: wafer fabrication, electronics assembly, and semiconductor packaging. He is an electronics industry expert in physical chemistry, surface chemistry, rheology, solder materials properties and processes (including solder paste printing), and reflow.
Andy has written papers and lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to pin-probe testing of flux residues. Additionally, he holds patents in novel polymers, gas analysis, and solder paste formulation and is trained in Six Sigma – Design of Experiments.
Andy earned a doctorate in physical chemistry from the University of Nottingham, UK, and a masters of science in surface and colloid chemistry from the University of Bristol, UK. He also authors the Semiconductor and Power Semiconductor Assembly Blog.
Mario joined Indium Corporation in 2000. He holds a bachelor’s degree in chemistry from Saint Anselm College and a certificate from the American Chemical Society for Professional Education. He is an SMTA-Certified Process Engineer and has a Six Sigma Black Belt from Dartmouth College’s Thayer School of Engineering. He is also the author of the Electronics Assembly Materials blog, https://www.indium.com/blogs/Mario-Scalzo-Blog/.
For more information about the show, visit www.imaps.org/automotive.
Indium Corporation 是全球電子、半導體、太陽能、薄膜及熱管理市場的主要材料供應商。產品包括焊料、預成型品和助熔劑；钎料；濺鍍靶材；铟、鎵和锗金屬及化合物；以及 Reactive NanoFoil®。Indium Corporation 成立於 1934 年，擁有全球性的技術支援，工廠位於中國、新加坡、南韓、英國和美國。
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