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Indium Corporation Experts to Share Technical Expertise at IMAPS Exhibition

Indium Corporation experts will present their technical findings at the IMAPS 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging May 22-23, in Dearborn, MI.

Global Product Manager: Semiconductor and Advanced Assembly Materials Andy C. Mackie, PhD, MSc, will chair the paper session on die attach.

Senior Technical Support Engineer Mario Scalzo will present IGBT’s from the Top Down; Electrical & Thermal Connectivity from Die Attach to Heat Sink, which discusses the way solders perform in the stack up, from die attach to heat sink, focusing on thermal transfer value and reliability data.

Andy has more than 20 years of experience in new product and process development and materials marketing in all areas of electronics manufacturing, including: wafer fabrication, electronics assembly, and semiconductor packaging. He is an electronics industry expert in physical chemistry, surface chemistry, rheology, solder materials properties and processes (including solder paste printing), and reflow.

从超临界二氧化碳中的亚ppb金属分析到助焊剂残留物的针探针测试,Andy撰写了多篇论文并在国际上发表演讲。此外,他还拥有新型聚合物、气体分析和焊膏配方方面的专利,并接受过六西格玛--实验设计方面的培训。

Andy 拥有英国诺丁汉大学物理化学博士学位和英国布里斯托尔大学表面与胶体化学理学硕士学位。他还是半导体和功率半导体组装博客的作者。

Mario joined Indium Corporation in 2000. He holds a bachelor’s degree in chemistry from Saint Anselm College and a certificate from the American Chemical Society for Professional Education. He is an SMTA-Certified Process Engineer and has a Six Sigma Black Belt from Dartmouth College’s Thayer School of Engineering. He is also the author of the Electronics Assembly Materials blog, https://www.indium.com/blogs/Mario-Scalzo-Blog/.

欲了解更多展会信息,请访问www.imaps.org/automotive。

Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium metals and compounds; and Reactive NanoFoil®. Founded in 1934, Indium Corporation has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

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