Indium Corporation experts will present their technical findings at the IMAPS 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging May 22-23, in Dearborn, MI.
全球产品经理：半导体和先进组装材料全球产品经理、理学硕士Andy C. Mackie 博士将主持关于芯片附着的论文会议。
高级技术支持工程师Mario Scalzo将介绍IGBT 的自上而下；从芯片连接到散热器的电气和热连接，讨论焊料在从芯片连接到散热器的堆叠过程中的性能，重点是热传递值和可靠性数据。
Andy 在电子制造的各个领域，包括晶圆制造、电子组装和半导体封装领域，拥有 20 多年的新产品和工艺开发及材料营销经验。他是物理化学、表面化学、流变学、焊接材料特性和工艺（包括锡膏印刷）以及回流焊方面的电子行业专家。
从超临界二氧化碳中的亚ppb金属分析到助焊剂残留物的针探针测试，Andy撰写了多篇论文并在国际上发表演讲。此外，他还拥有新型聚合物、气体分析和焊膏配方方面的专利，并接受过六西格玛--实验设计方面的培训。
Andy 拥有英国诺丁汉大学物理化学博士学位和英国布里斯托尔大学表面与胶体化学理学硕士学位。他还是半导体和功率半导体组装博客的作者。
Mario joined Indium Corporation in 2000. He holds a bachelor’s degree in chemistry from Saint Anselm College and a certificate from the American Chemical Society for Professional Education. He is an SMTA-Certified Process Engineer and has a Six Sigma Black Belt from Dartmouth College’s Thayer School of Engineering. He is also the author of the Electronics Assembly Materials blog, https://www.indium.com/blogs/Mario-Scalzo-Blog/.
欲了解更多展会信息，请访问www.imaps.org/automotive。
Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium metals and compounds; and Reactive NanoFoil®. Founded in 1934, Indium Corporation has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
