Indium Corporation will feature its new Flip-Chip Flux WS-446HF and Ball Attach Flux WS-823 at Productronica China, March 20-22, in Shanghai, China.
Indium Corporation’s WS-446HF is a water-soluble, halogen-free, flip-chip dipping flux with an activator system powerful enough to promote good wetting on the most demanding surfaces – including solder-on-pad (SoP), Cu-OSP, ENIG, embedded trace substrates (ETS), and flip-chip on leadframe applications. WS-446HF provides:
- Excellent solderability to reduce open joints
- Tackiness suitable for holding large die in place during assembly and reducing die tilt
- Chemistry that eliminates dendrite issues
- Reduced voiding
- Good cleanability
WS-823 is a water-soluble, halogen-free, ball-attach flux designed for use in pin transfer and printing applications for ball attachment to both substrates (BGA manufacturing) and wafers for WLP (wafer-level packaging). WS-823 offers:
- Excellent solderability on some of the most demanding substrate metallizations, such as copper OSP
- Lower process costs and warpage due to the elimination of “pre-fluxing”
- Consistent flux deposition
- Good tack during heating combined with fast soldering eliminates missing ball
- Low-cost simplified cleaning
Both WS-446HF and WS-823 are cleanable with just DI water only.
For more information on Indium Corporation’s fluxes, visit indiumstg.wpenginepowered.com/flux-and-epoxy/ or visit Indium Corporation’s booth #E2.2514.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
