Indium Corporation will feature its new Flip-Chip Flux WS-446HF and Ball Attach Flux WS-823 at Productronica China, March 20-22, in Shanghai, China.
Indium Corporation’s WS-446HF is a water-soluble, halogen-free, flip-chip dipping flux with an activator system powerful enough to promote good wetting on the most demanding surfaces – including solder-on-pad (SoP), Cu-OSP, ENIG, embedded trace substrates (ETS), and flip-chip on leadframe applications. WS-446HF provides:
- Excellent solderability to reduce open joints
- Tackiness suitable for holding large die in place during assembly and reducing die tilt
- Chemistry that eliminates dendrite issues
- Reduced voiding
- Good cleanability
WS-823 is a water-soluble, halogen-free, ball-attach flux designed for use in pin transfer and printing applications for ball attachment to both substrates (BGA manufacturing) and wafers for WLP (wafer-level packaging). WS-823 offers:
- Excellent solderability on some of the most demanding substrate metallizations, such as copper OSP
- Lower process costs and warpage due to the elimination of “pre-fluxing”
- Consistent flux deposition
- Good tack during heating combined with fast soldering eliminates missing ball
- Low-cost simplified cleaning
Both WS-446HF and WS-823 are cleanable with just DI water only.
For more information on Indium Corporation’s fluxes, visit indiumstg.wpenginepowered.com/flux-and-epoxy/ or visit Indium Corporation’s booth #E2.2514.
铟泰公司 是一家面向全球电子、半导体、薄膜及热管理 市场的顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊 ；热界面材料；溅射靶材 ；铟、镓（Ga） 、锗和锡等金属及无机材料化合物 ；以及NanoFoil®。该公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚 、新加坡 、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
