Indium Corporation will feature its unique solid/liquid hybrid metal thermal interface materials — m2TIM™ — during the Semi-Therm 35thAnnual Symposium & Exhibit, March 18-22, San Jose, California, USA.
Indium Corporation’s m2TIMTM combines liquid metal with a solid metal preform to provide reliable thermal conductivity for heat dissipation without the need for a solderable surface. The presence of a solid solder preform absorbs and contains the liquid alloys while improving thermal conductivity.
Available in InGa and InGaSn, this m2TIMTM hybrid approach provides extraordinary wetting ability to both metallic and non-metallic surfaces and low interfacial resistance. It also eliminates the risk of pump-out of the liquid alloy.
Presentations and posters will be available at the show to give you more in-depth information about this unique product. Please visit Indium Corporation at booth #405 to talk with their experts.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
