Indium Corporation's Graham Wilson, applications engineer, will present at the IMAPS France Workshop on Thermal Management in La Rochelle, France, on Feb. 5, 2015.
Wilson's paper, Sn+ Heat-Spring® Solder TIMs for Superior Thermal Management, explores how Heat-Spring thermal interface materials (TIMs) perform against phase change materials and thermal greases under a variety of conditions. Wilson will also present comparative results as they relate to power cycling and bake testing, and discuss the advantages of Heat-Springs®.
Wilson is an applications engineer for Indium Corporation's European operations. He supports customers with comprehensive technical advice on the selection, use, and application of solder pastes, fluxes, and engineered solders. He has more than 20 years of experience spanning a number of industries, including a focus on electronics assembly and thermal management. He is certified as a Six Sigma Green Belt through Dartmouth College's Thayer School of Engineering and shares his expertise at conferences internationally. Wilson earned his degree in HNC Electronics from the University of Northampton.
IMAPS France has more than 200 members who are dedicated to promoting the knowledge and expertise of organizations and businesses in the electronics packaging and assembly industries.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
