Indium Corporation's Graham Wilson, applications engineer, will present at the IMAPS France Workshop on Thermal Management in La Rochelle, France, on Feb. 5, 2015.
Wilson's paper, Sn+ Heat-Spring® Solder TIMs for Superior Thermal Management, explores how Heat-Spring thermal interface materials (TIMs) perform against phase change materials and thermal greases under a variety of conditions. Wilson will also present comparative results as they relate to power cycling and bake testing, and discuss the advantages of Heat-Springs®.
Wilson is an applications engineer for Indium Corporation's European operations. He supports customers with comprehensive technical advice on the selection, use, and application of solder pastes, fluxes, and engineered solders. He has more than 20 years of experience spanning a number of industries, including a focus on electronics assembly and thermal management. He is certified as a Six Sigma Green Belt through Dartmouth College's Thayer School of Engineering and shares his expertise at conferences internationally. Wilson earned his degree in HNC Electronics from the University of Northampton.
IMAPS France has more than 200 members who are dedicated to promoting the knowledge and expertise of organizations and businesses in the electronics packaging and assembly industries.
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持体系，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
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