Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste at SMT Hybrid Packaging, June 5-7, in Nuremberg, Germany.
Indium8.9HF Solder Paste is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry.
Indium8.9HF 系列提供免清洗、無鹵素的焊膏解決方案，可在印刷製程中產生低揮發，並提高穩定性。Indium8.9HF：
- 在冷藏儲存長達 12 個月的時間內，仍可展現一致的印刷與回流焊效能
- 在室溫下放置一個月後，仍可維持優異的印刷與回流焊效能
- 即使在網版上放置 60 小時，仍可提供優異的暫停印刷反應性能
With all these qualities, Indium8.9HFsolder paste is able to enhance the reliability of the final product in three ways:
- 改善熱傳導性與熱穩定性，具備業界公認的低揮发性能
- Enhanced mechanical reliability when paired with Indium Corporation’s newest high-reliability alloy, Indalloy®276, which allows for a stable and consistent performance under a harsh environment (Indalloy®276 is ideal for operating temperatures equal to or greater than 150°C)
- SIR 增強，電氣可靠性更高
For more information about Indium8.9HF Solder Paste and its use in automotive electronics, visit indiumstg.wpenginepowered.com/avoidthevoid or stop to see us at the show at booth #4-301.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
