Indium Corporation will help attendees Avoid the Void® by featuring its ultra-reliable Indium8.9HF Solder Paste series at SMTA Guadalajara Technical Forum and Expo, Nov. 14-15 in Guadalajara, Mexico.
Indium8.9HF is an air reflow, no-clean solder paste that has been tested and approved for use in the automotive electronics industry.
The Indium8.9HF series enhances the reliability of automotive products in three ways:
- 以業界公認的「低揮發」效能，改善熱傳導性與熱穩定性
- Enhances mechanical reliability, which allows for stable and consistent performance under harsh environments
- Provides higher electrical reliability with an enhanced SIR
See our experts at the show in Booth #136 or visit indiumstg.wpenginepowered.com/avoidthevoid to learn more.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
