Indium Corporation will help attendees Avoid the Void® by featuring its ultra-reliable Indium8.9HF Solder Paste series at SMTA Guadalajara Technical Forum and Expo, Nov. 14-15 in Guadalajara, Mexico.
Indium8.9HF is an air reflow, no-clean solder paste that has been tested and approved for use in the automotive electronics industry.
The Indium8.9HF series enhances the reliability of automotive products in three ways:
- 经过行业验证的低空泡性能可提高导热性和热可靠性
- Enhances mechanical reliability, which allows for stable and consistent performance under harsh environments
- Provides higher electrical reliability with an enhanced SIR
See our experts at the show in Booth #136 or visit indiumstg.wpenginepowered.com/avoidthevoid to learn more.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
