Indium Corporation will help attendees Avoid the Void® by featuring its ultra-reliable Indium8.9HF Solder Paste series at SMTA Guadalajara Technical Forum and Expo, Nov. 14-15 in Guadalajara, Mexico.
Indium8.9HF is an air reflow, no-clean solder paste that has been tested and approved for use in the automotive electronics industry.
The Indium8.9HF series enhances the reliability of automotive products in three ways:
- Improves thermal conductivity and thermal reliability with industry-proven low-voiding performance
- Enhances mechanical reliability, which allows for stable and consistent performance under harsh environments
- Provides higher electrical reliability with an enhanced SIR
See our experts at the show in Booth #136 or visit indiumstg.wpenginepowered.com/avoidthevoid to learn more.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
