Indium Corporation will feature an innovative alloy and solder flux pairing that provides high-reliability and enhanced-performance capabilities at IPC APEX Expo February 4-6, in San Diego, Calif., USA.
Indalloy®292 is an innovative alloy engineered to provide advanced reliability for high-performance applications. It has excellent thermal cycling performance at -40–150°C conditions, high shear strength, and low solder joint cracking. Additionally, the alloy eliminates pinholes to improve joint appearance.
When paired with Indium8.9HF solder paste flux vehicle, Indalloy®292 provides outstanding printability, stability, and enhanced SIR performance. Indium8.9HF is formulated to accommodate the high processing temperatures required by Indalloy®292. It delivers no-clean, halogen-free solutions designed to produce low-voiding, enhance electrical reliability, and improve stability during the printing process.
Indium8.9HF Solder Paste:
- 透過增強表面絕緣電阻 (SIR)，抑制電流洩漏和樹枝狀生長，提高電氣可靠性
- Ensures low-voiding on bottom termination components (ex. QFN, DPAK, LGA)
- Delivers supreme product stability with:
- 即使在鋼板上放置 60 小時，仍有極佳的暫停反應
- 在室溫下放置一個月後，印刷和回流焊性能增強
- 冷藏時可保持長達 12 個月的穩定列印效能
- Provides excellent pin-in-paste and through-hole solderability
- 防止助焊劑過早擴散，防止表面氧化
- 適用於含 Pb 和不含 Pb 的合金。
For more information about Indalloy®292 with Indium8.9HF, visit indiumstg.wpenginepowered.com/solders/solder-alloys/.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another®(#FOETA), at www.facebook.com/indium or @IndiumCorp.
