Indium Corporation will feature an innovative alloy and solder flux pairing that provides high-reliability and enhanced-performance capabilities at IPC APEX Expo February 4-6, in San Diego, Calif., USA.
Indalloy®292 is an innovative alloy engineered to provide advanced reliability for high-performance applications. It has excellent thermal cycling performance at -40–150°C conditions, high shear strength, and low solder joint cracking. Additionally, the alloy eliminates pinholes to improve joint appearance.
When paired with Indium8.9HF solder paste flux vehicle, Indalloy®292 provides outstanding printability, stability, and enhanced SIR performance. Indium8.9HF is formulated to accommodate the high processing temperatures required by Indalloy®292. It delivers no-clean, halogen-free solutions designed to produce low-voiding, enhance electrical reliability, and improve stability during the printing process.
Indium8.9HF Solder Paste:
- 通过提高表面绝缘电阻（SIR ）来增强电气可靠性 ，从而抑制电流泄漏并晶枝生长
- Ensures low-voiding on bottom termination components (ex. QFN, DPAK, LGA)
- 凭借以下特点，确保产品具有极佳的稳定性：
- 这款印刷暂停响应 表现出色，即使在钢网 上放置了60小时后依然如此
- 在室温下放置一个月后，印刷和回流焊性能得到增强
- 冷藏条件下，印刷性能 的稳定性可持续长达12个月
- Provides excellent pin-in-paste and through-hole solderability
- 防止助焊剂过早扩散，防止表面氧化
- 既可与Pb配合使用，也可与无铅合金 配合使用。
For more information about Indalloy®292 with Indium8.9HF, visit indiumstg.wpenginepowered.com/solders/solder-alloys/.
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解有关“铟泰公司 ”的更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
