Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, electric vehicle (EV), thin-film, and thermal management markets, will feature a range of sustainable, high-reliability solder products at Productronica India, to be held September 17-19 in Bengaluru, India.
Indium Corporation 的創新焊料與合金技術，專為滿足電動車市場的嚴格要求而設計，該市場中，熱管理、可靠性與能源效率至關重要。其提升熱循環性能並降低能耗的能力，與業界追求永續發展及更長壽命產品的趨勢相契合。
該公司將在其重點產品中展示以下項目：
- Durafuse® HR, a trusted and proven solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
- Durafuse® LT is a solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature step soldering. It is ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior thermal cycling and drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and it even outperforms SAC305 with optimal process setup.
- Indalloy®303, or Bi+, is an innovative low-temperature solder developed to meet the challenges of modern electronics manufacturing. Featuring a unique doped bismuth composition, Bi+ delivers outstanding reliability and performance for sensitive components that demand precise thermal management. With enhanced thermal cycling capabilities and compatibility with Indium Corporation’s low-temperature flux technologies, Bi+ sets a new standard in the soldering industry.
- Indium12.9HF is a no-clean, halogen-free solder paste specifically formulated to accommodate fine-feature printing, as seen with 01005 and 008004 components. It offers unprecedented stencil print transfer efficiency to work in the broadest range of processes to boost SPI yields. Indium12.9HF also delivers low voiding at BGA, CSP, LGA, and QFN and high oxidation resistance without graping or solder balling on pads as small as 175 microns in air reflow.
- CW-807RS is a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
- InFORMS®是一種強化型焊料預成型件，能提升機械強度並確保接合線厚度一致，相較於傳統焊料預成型件，可提供更卓越的可靠性表現，特別是在功率模組應用中。
To learn more about Indium Corporation’s innovative solutions for EV and electronics applications, visit our experts at Hall 4, Booth D71 at Productronica India.
關於 Indium Corporation
IndiumCorporation®是全球電子、半導體、薄膜及熱管理市場首屈一指的材料精煉商、冶煉廠、製造商及供應商。產品包括焊料與助焊劑；釬料；熱界面材料；濺鍍靶材；銦、鎵、鍺及錫的金屬與無機化合物；以及NanoFoil®。 本公司成立於 1934 年，擁有全球技術支援網絡，並在中國、德國、印度、馬來西亞、新加坡、南韓、英國及美國設有工廠。如需了解更多關於 Indium Corporation 的資訊，請造訪 indiumstg.wpenginepowered.com或發送電子郵件至 [email protected]。 您亦可透過 www.linkedin.com/company/indium-corporation/ 追蹤我們的專家團隊「From One Engineer ToAnother®」（#FOETA）。
