Indium Corporation will co-host a seminar with Process Lab.Micron on Advanced Void-Reducing Technologies for Infrastructure and Communications on Aug. 24 in Shanghai.
The seminar will include an introduction to Indium Corporation's latest halogen-free, Pb-free, no-clean, low-voiding solder paste technology, Indium10.1HF, by Dr. Ning-Cheng Lee and Mary Ma.
Technical experts will lead discussions on:
- InFORMS® and Solder Preforms in Electronics Assembly by Sunny Neoh Soon Chye
- DFX on High-Density Assembly by Wisdom Qu
- Semiconductor Materials for Infrastructure and Communications by Aaron Yan
Dr. Ning-Cheng Lee, Indium Corporation Vice President of Technology, will provide a session focusing on:
- Low temperature solders
- High-reliability solder alloy for wide service temperature capability
- Pressureless Ag/Cu sintering paste
For more information or to register for this seminar, contact [email protected].
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
Process Lab.Micron Co., Ltd. is a stencil manufacturer known for developing numerous groundbreaking technologies, such as additive and laser-cut stencils, which have become well established in the stencil industry. The company develops, manufactures, and sells metal masks for electronics component mounting, and precision versions for semiconductor packages and display masks. Process Lab.Micron also performs precision machining and prototyping by etching, plating, and laser cutting. For more information on Process Lab.Micron, visit www.lab-micron.co.jp.
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
