Indium Corporation will co-host a seminar with Process Lab.Micron on Advanced Void-Reducing Technologies for Infrastructure and Communications on Aug. 24 in Shanghai.
The seminar will include an introduction to Indium Corporation's latest halogen-free, Pb-free, no-clean, low-voiding solder paste technology, Indium10.1HF, by Dr. Ning-Cheng Lee and Mary Ma.
Technical experts will lead discussions on:
- InFORMS® and Solder Preforms in Electronics Assembly by Sunny Neoh Soon Chye
- DFX on High-Density Assembly by Wisdom Qu
- Semiconductor Materials for Infrastructure and Communications by Aaron Yan
Dr. Ning-Cheng Lee, Indium Corporation Vice President of Technology, will provide a session focusing on:
- Low temperature solders
- High-reliability solder alloy for wide service temperature capability
- Pressureless Ag/Cu sintering paste
For more information or to register for this seminar, contact [email protected].
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
Process Lab.Micron Co., Ltd. is a stencil manufacturer known for developing numerous groundbreaking technologies, such as additive and laser-cut stencils, which have become well established in the stencil industry. The company develops, manufactures, and sells metal masks for electronics component mounting, and precision versions for semiconductor packages and display masks. Process Lab.Micron also performs precision machining and prototyping by etching, plating, and laser cutting. For more information on Process Lab.Micron, visit www.lab-micron.co.jp.
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
