Indium Corporation Regional Product Manager Wisdom Qu will present at the SMTA China South Technical Conference, held in conjunction with NEPCON Asia, on October 11 in Shenzhen, China.
Qu will present on the challenges of large BGA warpage and the use of low-temperature soldering processes to solve those challenges. With the rapid growth of 5G computing and AI, the high integration design of CPU/GPU BGAs poses typical challenges for the electronics assembly industry. Large BGA and PCB HDI design and mismatched coefficients of thermal expansion have become more severe. These challenges can result in excessive warpage of BGAs during the manufacturing process, resulting in a number of solder defects.
“To reduce thermal deformation in BGAs and PCBs, the industry is exploring the use of low-temperature soldering processes,” said Qu. “Bi/Sn-based low-temperature solder alloys, with their lower melting points, can decrease thermal stress during the soldering process, thereby reducing thermal deformation.”
As Regional Product Manager for PCB Assembly Solder Paste in Asia, Qu facilitates business development and growth of PCB assembly product offerings, focusing on solder paste. A certified SMT process engineer, she has more than 17 years of experience in surface mount technology and earned a degree in mathematics from Hubei Radio and Television University in China.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以在www.linkedin.com/company/indium-corporation/ 追蹤我們的專家，From One Engineer To Another (#FOETA)。
