Indium Corporation Regional Product Manager Wisdom Qu will present at the SMTA China South Technical Conference, held in conjunction with NEPCON Asia, on October 11 in Shenzhen, China.
Qu will present on the challenges of large BGA warpage and the use of low-temperature soldering processes to solve those challenges. With the rapid growth of 5G computing and AI, the high integration design of CPU/GPU BGAs poses typical challenges for the electronics assembly industry. Large BGA and PCB HDI design and mismatched coefficients of thermal expansion have become more severe. These challenges can result in excessive warpage of BGAs during the manufacturing process, resulting in a number of solder defects.
“To reduce thermal deformation in BGAs and PCBs, the industry is exploring the use of low-temperature soldering processes,” said Qu. “Bi/Sn-based low-temperature solder alloys, with their lower melting points, can decrease thermal stress during the soldering process, thereby reducing thermal deformation.”
As Regional Product Manager for PCB Assembly Solder Paste in Asia, Qu facilitates business development and growth of PCB assembly product offerings, focusing on solder paste. A certified SMT process engineer, she has more than 17 years of experience in surface mount technology and earned a degree in mathematics from Hubei Radio and Television University in China.
关于铟泰铟泰公司
铟泰公司 是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil 。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
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