铟 金属在室温下具有独特的冷焊（粘接）能力。虽然从技术上讲，这并不是 焊接, this property makes it especially useful for low-temperature bonding applications. Back in 2008 我在半导体封装博客上提到过铟冷焊.以下是一些其他资源，供您进一步了解这一过程：
- The official Cold Welding Application Note
- Using indium in a cryogenic seal application.
- 将铟用于 Flip-chip applications
Cold welding is a great solution to some really tricky bonding applications. Some nice features of using indium cold welding as a bonding method are:
1) It offers an instant attachment. Because indium will stick together upon physical contact (with a slight amount of pressure) the bonding process takes a fraction of a second as opposed to reflow soldering processes for solders or curing processes for epoxies – which can take seconds to many minutes.
2) It requires no heat. Temperature-sensitive components can be assembled without heating. The stresses that occur due to CTE (coefficient of thermal expansion) are also not an issue, which makes this a great process for attaching large dissimilar CTE materials like brittle ceramics and high expansion rate metals.
3) 由于该工艺中使用的铟的性质，粘合剂将具有优异的导热性和导电性。
您可以在任何可以成功溅射、蒸发、回流或镀铟的材料上使用铟冷焊工艺。
老问题的答案是"铟冷焊的预期寿命和相关强度是多少？
冷焊粘接将无限期地持续下去，其粘接强度接近于实心铟块的粘接强度（273 PSI）。
如有问题，请发送电子邮件至 [email protected].
