Indium Corporation announces the company’s Silver Quill Award winners for 2010.
Mike Fenner, Technical Projects Manager, European Operations, Dr. Andy Mackie, Global Product Manager, Semiconductor and Advanced Assembly Materials, and Graham Wilson, Applications Engineer, authored the award winning paper, "New Developments in High Performance Solder Products for Power Die Assemblies". This paper was written for and presented at IMAPS 2010 in Raleigh, North Carolina.
Ed Briggs, Technical Support Engineer and Dr. Ronald Lasky, Senior Technologist, were presented with the Silver Quill’s Impact on the Industry award. Their paper, "Process Optimization to Prevent the Graping Effect", was written for and presented at SMTA’s International Conference on Soldering and Reliability, in Toronto, Canada.
Copies of the papers are available for download on Indium Corporation’s website.
Indium’s Silver Quill Award was developed to encourage individuals to author technical reports, presentations, articles, and books and to honor the most effective works. Points are awarded for the quality and quantity of the work and for the region and market the work addresses.
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料供应商。 产品包括焊料、焊片助焊剂；硬钎焊；溅射靶材；铟、镓（Ga）和锗的化学品及采购服务；以及Reactive NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持网络，并在中国、新加坡、韩国、英国和美国设有工厂。
如需了解有关铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至[email protected]。
