Indium Corporation's Maria Durham, Technical Support Engineer for Semiconductor and Advanced Assembly Materials, will present and co-chair a technical session at the International Microelectronics Assembly and Packaging Society (IMAPS) New England Chapter 2015 Symposium and Expo on May 5 in Boxborough, Mass.
The semiconductor assembly industry continues its movement toward finer-pitch materials and reduced copper pillar height. As a result, cleaning processes are increasingly more difficult. Durham's presentation, Ultra-Low Residue (ULR) Semiconductor-Grade Fluxes for Flip-Chip and MEMs Application, discusses the use of semiconductor-grade, ultra-low residue, no-clean fluxes that help meet this industry challenge. Her presentation also discusses the benefits of using ULR no-clean fluxes.
In addition to her presentation, Durham will also serve as a session co-chair for Advanced Technologies for 2.5D/3D Packaging, which will discuss the impact of high-density 3D packages, other aspects of 2.5D/3D integration technology and applications, and copper pillar and underfill challenges.
Durham serves as a technical liaison between Indium Corporation's customers and internal departments, such as sales, technical support, research and development, and operations to guarantee the best quality and selection of products. She earned her bachelor's degree in physics and applied mathematics from Clarkson University in Potsdam, N.Y.
IMAPS is a global community of microelectronic related engineers, scientists, manufacturers, end-users, and supply chain companies. The Society aims to support the development and growth of the microelectronics and related industries, and to aid the transfer of knowledge and information.
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持体系，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
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