Indium Corporation experts will share their knowledge and expertise at IMAPS 50th International Symposium on Microelectronics, Oct. 10-12, in Raleigh, NC.
Vice President of Technology Dr. Ning-Cheng Lee will teach a professional development course, Choosing Solders for the New Era: Low-Cost High-Reliability Solder Alloys. This course explores the roles of solder composition in relation to cost and reliability, including materials properties, soldering performance, known failure modes, and the primary merit of discussed alloys.
Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will co-chair a session on polymers in microelectronics (WA5). This session focuses on the development of polymers for use as encapsulates, dielectrics, conductors, and resistors for use in microelectronic devices.
Tim Jensen, Product Manager for Engineered Solders Materials, will present Reinforced Solder Technology for Increased Reliability. The presentation details the outcomes of a study that showed how, through an optimized design, a reinforced solder preform can produce a solder joint with high-reliability and low-voiding.
Jensen will also co-chair a session on reliability (THA5). This session focuses on several facets of electronics reliability that are impacted as devices generate more power from smaller form factors in broader ranges of applications.
To register for the IMAPS conference, visit: www.imaps.org/imaps2017.
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
