助焊剂和基底兼容性
助焊剂是一种液态、固态或气态材料，加热时通过助焊剂去除基底材料表面的氧化物，加快和/或促进基底材料的润湿。在焊接过程中，助焊剂可防止进一步氧化。
助焊剂是大多数焊接操作的重要组成部分。使用正确的助焊剂是确保焊接可靠的关键。
右侧的图表可帮助您根据应用选择正确的助焊剂类型。大多数回流焊后助焊剂残留物都需要清除，以避免腐蚀或美观。
还原气体气氛是一种由一种或多种气体（通常是氢气和氮气等惰性填充气体）组成的气态气氛。例如，氢气可以减少氧化物，而氮气则保持惰性。建议两种气体同时存在，以实现助焊作用。最佳温度约为 350°C。
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