Indium Corporation’s Tim Jensen, Product Manager for Engineered Solder Materials, will present on liquid metal interface technology during IMAPS New England 46th Symposium & Expo, May 7, Boxboro, Massachusetts, USA.
詹森的演讲题目是 "液态金属在高性能热界面材料（TIM）方面的创新"，他将探讨金属的导热值如何使其成为备受青睐的热界面材料（TIM）。虽然金属的硬度会因界面阻力大而限制其有效性，但液态金属合金却能保持同样的高热导率，而不会受到固态合金的限制。他的演讲将探讨可以克服工艺挑战的方法和技术，使液态金属能够用于更广泛的 TIM1 和 TIM2 应用。
Jensen is an SMTA-certified process engineer. He has more than 20 years of experience working with customers to troubleshoot and optimize SMT process lines and solving defects, such as head-in-pillow, graping, and QFN voiding. Jensen has worked directly on hundreds of surface mount lines and developed a number of different products. Using that direct knowledge and expertise, he works closely with Indium Corporation’s technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry. As senior product manager, Jensen is responsible for Indium Corporation’s most diverse product group, which includes solder preforms, wire, ribbon and foil, and thermal interface materials. He earned his bachelor’s degree in chemical engineering from Clarkson University and his master’s in business administration from Syracuse University.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
