Indium Corporation’s Jason Chou, Area Technical Manager – Taiwan, will present at SEMICON Taiwan 2019, September 18-20 in Taipei, Taiwan.
Chou will present Challenges and Solutions in the Flip-Chip and BGA Ball-Mount Process, which examines how the increased complexity in semiconductor packaging technology creates many reliability challenges for processes and materials. These challenges include warpage caused by thinner die and packages, cleaning issues due to low standoff and microbump applications, and solder joint and wetting issues on micro Cu-pillar bumps. In his presentation, Chou will introduce some of the innovative fluxes, soldering materials, and other solutions to ensure the manufacturability and long-term reliability of advanced packages.
Chou provides technical support to Indium Corporation’s customers in Taiwan with a focus on the semiconductor industry. Chou earned his master’s degree in chemistry from National Tsing Hua University and his bachelor’s degree in chemistry from National Cheng Kung University. He has served as the group leader for the National Nano Device Laboratories in Tainan, Taiwan, where he collaborated with university professors and industry professionals on special projects for semiconductor manufacturing.
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
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