Indium Corporation announces the Heat-Spring® metallic thermal interface material (TIM) specifically designed and optimized for use with Infineon Technologies AG PrimePACKTM IGBT modules.
Many applications call for a TIM that can easily be placed against a backing plate and a cooling solution. Indium’s Heat-Spring® is a soft metal alloy (SMA) developed as a compressible metallic shim that can be used in IGBT mounting applications.
Heat-Spring has been tested for the latest PrimePACK configurations and has been optimized to reduce thermal resistance below that of other more traditional thermal interface materials.
Because of the increased number of fasteners used in the PrimePACK and its decreased width base plate, the Heat-Spring is ideal for this IGBT module.
Heat-Springs are soft metal preforms that are compressible, allowing for adaptation to irregularities in the mounting surface. They do not contain silicone, do not out-gas, and do not exhibit pump-out which can occur with thermal greases and other viscous materials.
热弹簧性能稳定，易于操作，不需要特殊的安装装置。它们具有很强的导热性和导电性。 热弹簧还由 100% 可回收和可再生金属制成，被视为 "绿色 "界面材料。
From design through assembly, Indium’s Heat-Spring delivers superior performance and overall finished goods reliability.
铟泰公司 面向全球电子组装、半导体制造与封装、光伏以及热管理 顶级材料供应商。该公司成立于1934年，提供以先进材料科学为核心的广泛产品、服务及技术支持。 公司在中华人民共和国、新加坡、韩国、英国和美国均设有生产基地，曾四次荣获弗若斯特沙利文奖，并通过了ISO-9001认证。
For more information about Thermal Interface Materials, visit Indium’s Thermal blog: indiumstg.wpenginepowered.com/blogs/TIM-Blog/.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com/TIM or email [email protected].
