Indium Corporation has expanded its portfolio of proven pastes with a new no-clean, halogen-free solder paste designed for advanced LED applications, including COB, COG, SMT, and other LED varieties.
LEDPaste NC38HF combines superior wetting performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements for miniLED applications. It offers excellent printability down to 60-micron apertures. MiniLEDs typically feature a length of less than 240 microns on the component edge; this material offers excellent compatibility with the current size of miniLEDs and as future die continue to miniaturize.
LEDPaste NC38HF delivers:
- Consistent and tight solder deposit spread across multiple prints and excellent response-to-pause characteristics
- Minimal voiding on tight-pitch components, ensuring joint strength on small components
- Industry-leading non-wet open (NWO) performance using superior oxidation barrier technology, enabling reduced solder ball and solder beading defects and enhanced graping performance
- Enhanced slump performance with minimal bridging during the assembly process, improving yields for tight-pitch components
A proven product, LEDPaste NC38HF was recognized with an award for Excellent Product of the Year at the MiniLED conference in Shenzhen, China on Nov. 10.
For more information about Indium Corporation’s pastes for mini/microLED applications, contact Evan Griffith, product specialist semiconductor and advanced assembly materials.
关于铟泰铟泰公司
铟泰公司 是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil 。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
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