Indium Corporation is proud to introduce a novel alloy technology that enables lower processing temperatures in preform soldering, at Productronica 2023, November 14-17, in Munich, Germany. Specifically developed for power module package-attach applications, Indalloy301-LT is a bismuth-free alloy that prevents thermal defects in the module without sacrificing reliability like traditional bismuth-containing, low-temperature alloys.
Available in InFORMS configurations, Indalloy301-LT offers a solution for consistent bondline thickness and improved strength to enhance thermal and mechanical reliability of the solder joint while reducing processing temperature and energy input during manufacturing. This enables complementary Pb-free high-reliability alloy technologies such as Indalloy276 to be used in power module die-attach, component-attach, or interconnects without the risk of re-melt and degraded performance. Indalloy301-LT is also available in preforms and ribbon configurations and can be offered flux-free or with Indium Corporation’s flux coating technology.
“With increasing mission profile demands in power electronics applications, such as EV power module-cooler integration, preform soldering offers superior thermal and mechanical performance compared to traditional thermal interface materials,” said Product Manager Joe Hertline. “By leveraging this new alloy technology in package-attach applications, designers can prevent warpage, encapsulation breakdown and delamination issues by reducing processing temperature, making preform soldering a viable approach with robust thermal and mechanical reliability performance.”
Indalloy301-LT features:
- Reduced reflow peak temperatures by 50C compared to commonly used alloys in power electronics assembly
- Prevention of warpage and delamination in molded power module package-attach
- Ability to step-solder with Pb-free alloys
- Excellent thermal and electrical conductivity
- Solid reliability performance (TST -40C125C)
- Reduced energy consumption
- Available in preforms, ribbon, and InFORMS
For more information about Indium Corporation’s high-reliability alloy products, visit indiumstg.wpenginepowered.com/products/solders/solder-alloys/ or contact Joe Hertline.
关于铟泰铟泰公司
铟泰公司 是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil 。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/.
