Indium Corporation Launches InFORMSESM02 for Die-Level Bonding

Indium Corporation has launched InFORMS^® ESM02, a reinforced matrixed solder composite specifically designed to produce consistent bondline thickness for die-level attach applications.

Indium Corporation's InFORMS^® ESM02 is a reinforced solder fabrication that produces a high-reliability solder joint with increased thermal and mechanical performance.

Until recently, InFORMS^® technology was only applied at the baseplate level. New production capabilities have expanded its use to the die-level with a bondline of 50μm. Other benefits of InFORMS^® include:

• Drop-in replacement for other bondline control methods
• Increased lateral strength
• Bondline co-planarity
• Improved thermal cycling reliability
• Available in ribbon and preforms

铟泰公司 是一家面向全球电子、半导体、薄膜及热管理 市场的顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊 ；热界面材料；溅射靶材 ；铟、镓（Ga） 、锗和锡等金属及无机材料化合物 ；^{以及NanoFoil®。}该公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚 、新加坡 、韩国、英国和美国设有工厂。

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