Indium Corporation’s Applications Engineer Amanda Hartnett will present her technical findings at IMAPS Mid-Atlantic Microelectronics Conference in Atlantic City, NJ, June 23-24, 2011.
Amanda’s presentation, Metallic TIMs for High-Brightness LED Packaging, will include a discussion of metallic TIMs and solders, including packaging techniques required for use and the expected performance derived from independent thermal materials testing, as well as in-situ testing completed on functional LED boards.
Amanda provides advice on thermal design issues in many different industries, including communications, military, and photonics. Amanda specializes in coaching manufacturing, process, and design engineers on their choice and application of solder interface materials and other bonding materials to achieve reliable and high-performance thermal attachment solutions.
Amanda has presented at industry technical seminars and authored technical papers on thermal management and microelectronics packaging materials. She is active in several industry organizations including SPIE, IMAPS, and the IPC.
Prior to establishing her career with Indium Corporation, Amanda received her bachelor’s degree in Chemistry from Utica College and worked as a research lab technician at Cornell University, focusing on the physical properties of silicon. She is a member of the American Chemical Society. Amanda is based at Indium Corporation’s global headquarters in Clinton, NY and resides in Utica, NY. She also authors a technology blog, which can be found at http://blogs.indium.com/blog/amanda-hartnett.
For more information on the IMAPS Mid-Atlantic Microelectronics Conference, visit http://www.imaps.org/programs.
Indium Corporation 是全球电子、半导体、太阳能、薄膜和热管理市场的主要材料供应商。产品包括焊料、预型件和助焊剂；钎料；溅射靶材；铟、镓和锗化学品及采购；以及 Reactive NanoFoil®。Indium 公司成立于 1934 年，在中国、新加坡、韩国、英国和美国都有全球技术支持和工厂。
有关 Indium Corporation 的更多信息，请访问www.indium.com或发送电子邮件至 [email protected]。
