Indium Corporation will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicles, at NEPCON Japan, January 2527 in Tokyo, Japan.
With its significant automotive industry expertise and an award-winning portfolio of proven products, Indium Corporation will feature:
- InFORMS是一种增强型焊接合金制造材料，可提高机械和热可靠性，专门设计用于为电源模块应用提供一致的焊线厚度。它们还为开发更可靠、更高性能的模块提供了增强材料，从而解决了电力电子行业面临的特殊挑战。
- Heat-Spring is a soft metal alloy (SMA) thermal interface material (TIM) that reduces thermal resistance and enhances cooling by utilizing two key properties of indium metalsuperior thermal conductivity and malleability. As added benefits, indium metal will not dissolve in immersion fluids and is considered an environmentally friendly TIM because it can be re-used, reclaimed, and re-formed.
- Indium Corporation’s new GalliTHERM family of liquid metal pastes (LMPs) is a true liquid metal-based TIM solution, based on proprietary technologies, that can handle challenging heat dissipation issues and maintain long-term reliability. Unlike traditional gallium-based liquid metals which are prone to pump-out and typically require specialized spreading processes, LMPs offer higher viscosity and predictable spreading characteristics for scalable high-volume applications, with a reduced risk of pump-out, at a lower total cost. LMPs are fully automation-ready in jetting, dispensing, and printing applications. They require no backside metallization and exhibit superior surface wettability resulting in extremely low contact resistance and offer stable thermal impedance through accelerated aging tests.
- QuickSinter is a high metal content paste, redefining sinter technology for power electronics. Available in pressureless and pressure formulations, this portfolio of sintering solutions delivers products engineered for customers’ specific application needs.
- Durafuse LT is an award-winning low-temperature alloy system designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210C. It delivers improved drop shock performance more than two orders of magnitude better than Bi-containing low-temperature materials and helps reduce energy consumption by 15%, depending on process.
- Durafuse HT 采用基于新型合金技术的新颖设计，旨在提供富锡高温无铅 (HTLF) 焊膏，同时兼具两种合金成分的优点。Durafuse HT 简化了加工过程，无需特殊设备，而且热循环可靠性更高，相当于或高于高铅焊料。
- Indium Corporation’s Au-based precision die-attach (PDA) preformsalso available in off-eutectic formulationsoffer the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. A leading gold solder innovator, Indium Corporation’s gold-based portfolio includes wire, paste, preforms, spheres, shot, and ribbon manufactured with cutting-edge technology to ensure supreme quality and the utmost precision.
关于铟泰铟泰公司
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
如需了解更多铟泰公司信息，请访问www.indium.com或发送邮件至黄静雅。您还可关注我们的专家团队"工程师同行"（，#FOETA）的推特账号www.linkedin.com/company/indium-corporation/或@IndiumCorp。
About NEPCON Japan
Launched more than 30 years ago, NEPCON Japan has grown together with the Japanese and Asian electronics industry. Consisting of six shows specialized in essential areas for electronics manufacturing and R&D, the show has increased its value as an exhibition representing Asia’s leading one-stop venue for all those involved in electronics industry.
