Indium Corporation will feature its proven soldering materials for Heterogeneous Integration & Assembly (HIA) applications at the 20th Electronics Packaging Technology Conference, Dec. 4-7 in Sentosa, Singapore.
Indium Corporation’s soldering materials for HIA and SiP applications have a proven track record of success in more than 2 billon front-end module SiP devices manufactured in the last three years using the company’s materials.
From water-soluble to no-clean soldering solutions, Indium Corporation’s portfolio of products meets current and evolving challenges encountered in fine-pitch Heterogeneous Integration and SiP applications.
See Indium Corporation’s experts at the show or visit the company’s HIA page at indiumstg.wpenginepowered.com/HIA to learn more.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
