Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will present Properties and Applications of Low-Temperature Solders as part of a webinar sponsored by the SMTA on January 28 from 1-3 p.m.
Dr. Lee will review key aspects of low-temperature soldering, including the design of low-temperature solder alloys, indium-bearing solder alloy systems and their properties, bismuth-bearing solder alloy systems and their properties, recent developments in boron-bearing low-temperature alloys, and applications of low-temperature solders.
For more information or to register, visit www.smta.org.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持网络，并在中国、新加坡、韩国、英国和美国设有工厂。
如需了解有关铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至[email protected]。
