Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste series at SMT Hybrid Packaging 2016 on April 26-28 in Nuremberg, Germany.
The Indium8.9HF Series is specifically formulated to Avoid the Void® while delivering high transfer efficiency with low variability.
In addition to outstanding print transfer efficiency and response-to-pause, these no-clean solder pastes also provide a number of other benefits, including excellent pin-in-paste solderability and hole-fill, robust reflow capability, and a wide process window.
The Indium8.9HF Series includes pastes perfectly suited for a variety of applications, especially automotive, due to a unique oxidation barrier technology.
The Indium8.9HF solder paste series is part of Indium Corporation’s family of high-performance, lead-free, low-voiding, no-clean solder pastes that help manufacturers to Avoid the Void®. For more information about Indium8.9HF, visit Indium Corporation at stand 7-331, email [email protected] or visit indiumstg.wpenginepowered.com/indium8.9series.
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
