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Indium Corporation’s Jacques Matteau, Global Sales Manager – NanoBond® and NanoFoil®, and Jim Hisert, PV Applications Engineer, will present at the Society of Vacuum Coaters (SVC)

Indium Corporation’s Joe Bahou, Technical Sales Support Engineer – West Coast, will present at the SMTA’s Silicon Valley chapter meeting on April 11. Bahou’s presentation,

Indium Corporation announces the creation of a Nanotechnology Team to support Indium Corporations continued expansion into novel nanotechnology materials and markets. Nanotechnology is a term that

Indium Corporation announces the appointment of Derrick Herron to Technical Support Engineer for the Northeastern United States. In this role, Herron will provide comprehensive technical advice in

Indium Corporation’s Ning-Cheng Lee, Vice President of Technology; Karthik Vijay, Technical Manager – Europe, Africa, and the Middle East; and Wolfgang Bloching, Regional Sales Manager

Indium9.91 is a no-clean solder paste designed for use in package-on-package (PoP) applications 0.3mm and larger. Its rheology optimizes both dipping and package retention. Indium9.91: Eliminates

Indium Corporation will feature its Indium8.9HFA Solder Paste and Solder Fortification® preforms at SMT Nuremberg April 16-18 in Nuremberg, Germany. Indium8.9HFA delivers unsurpassed print

Indium Corporation’s Jordan Ross, Senior Product Manager – Engineered Solders and Thermal Materials, and Dr. Weiping Liu, Research Metallurgist, will present a workshop on Composite

Indium Corporation will feature metal thermal interface materials (TIMs) at Semiconductor Thermal Management and Measurement Symposium (Semi-Therm), on March 17-21 in San Jose, CA. Indium Corporation

Indium Corporation’s Maria Durham, Product Specialist – Semiconductor and Advanced Assembly Materials, will present at the International Microelectronics and Packaging Society (IMAPS)

Indium Corporation’s Tim Jensen, Product Manager – PCB assembly materials, will present his technical findings at two regional SMTA shows in Texas; Dallas on March 12 and Houston on March

Indium Corporation’s Dr. HongWen Zhang, Research Metallurgist, will present at the Minerals, Metals, and Materials Society (TMS) on March 7, 2013 in San Antonio, Texas. Dr. Zhang’s

Indium Corporation’s Malcolm Harrower will present at CS International on March 4 in Frankfurt, Germany. Harrower’s presentation, An Overview of CS Critical Elements – Indium,

Indium Corporation announces the promotion of Lisa Clark to Inside Sales Team Leader. In addition to supporting Indium Corporation’s customers in the Midwest and Northern California, Clark is

Indium Corporation‘s Dr. Ning-Cheng Lee, vice president of technology, will present Voiding Control and Reliability of Solder Joints with Backward Compatibility as part of a webinar sponsored

Indium Corporation technology experts will share their technical expertise at the IPC APEX Expo February 19-21 in San Diego, California. Ning-Cheng Lee, PhD, Vice President of Technology Voiding

Indium Corporation will feature its Indium8.9 solder paste series, including Indium8.9HFA and Indium8.9HF-1, at IPC APEX February 19-21, 2013, in San Diego, California. These Pb-free and halogen-free

Indium Corporation will feature materials for LED manufacturing at Strategies in Light, February 12-14, 2013, in Santa Clara, California. Indium Corporation provides materials for every level of LED

Indium Corporation announces that Andy C. Mackie, PhD, MSc, has been named the Chair of the Editorial Advisory Board of Chip Scale Review magazine. Dr. Mackie’s responsibilities include

Indium Corporation received the Shining Star Company Award from the School and Business Alliance on December 7. The School and Business Alliance, a service of Oneida-Herkimer-Madison BOCES, assists

Several Indium Corporation technology experts served as judges for the Clinton High School Science Fair in Clinton, N.Y. on December 6. Amanda Hartnett, applications engineer; David Socha, marketing