Products Gold Solder AuLTRA® Fine Wire

AuLTRA®细金属丝

Indium Corporation’s AuLTRA® Fine Wire is a precision, high-reliability gold-tin wire suitable for medical, aerospace, and other critical applications. Our AuLTRA® Fine Wire delivers superior wetting and solderability, and offers high yield in automated processes. All solder wire complies with the requirements of ASTM B-32, J-STD-006 (formerly QQS-571F), and JIS-Z-3282.

技术支持:铟泰公司

  • Superior Wetting and Solderability
  • 自动化流程的高收益
  • High-Reliability for Critical Applications
金(Au)合金 轴和棒阵列。

能力

Range from 0.001″ (0.025mm) diameter to 0.250″ (6.35mm) and larger. Actual dimensions achievable are subject to the properties of each metal. We have developed standard tolerances but can work with you to accommodate any special requirements.

包装

Solder wire is packaged on spools. We can create specialized packaging to meet specific needs, such as spool size, quantity per spool, or other requirements.

送货

交货时间短,能让您及时收到订单,满足您的生产计划。每份订单在发货时都会附带一份分析证书,其中包括金属杂质的信息。如果钢丝是按照客户的规格制造的,我们还可以提供合格证书。

存储

The shelf life of solder wire is determined by the alloy and its resistance to oxidation, as well as the storage container and the conditions in which it is stored.

>280°C

Critical应用

无铅

可靠性排名第1

Diameter标准公差
Up to 0.002″ (0.050mm)± 0.0005″ (0.0127mm)
> 0.002″ (0.050mm) to 0.010″ (0.254mm)± 0.002″ (0.050mm)*
> 0.010″ (0.254mm) to 0.060″ (1.52mm)± 0.002″ (0.050mm)
> 0.060″ (1.52mm) to 0.250″ (6.35mm)± 0.003″ (0.076mm)
> 0.250″ (6.35mm)± 2.5%

产品数据表

AuLTRA® Fine Wire for Medical and Aerospace Applications PDS 100302 R0.pdf

相关应用

AuLTRA® Fine Wire is suitable for a variety of applications.

高温焊接

高温焊接

为关键应用提供耐高温焊接材料应用

Microchip being inserted onto PCB

High-Reliability

Various options for various high-reliability PCBA applications.

黑色带纹理的圆柱体,配有超低温 ,顶部贴有三个白色矩形标签。

密封:超低温 密闭

低温液体和低熔点合金

相关市场

铟泰公司 领先的金(Au) ,为以下领域提供适用于高温、可靠性及关键应用 (应用 芯片和密闭 )的解决方案:

您有技术问题或销售咨询吗?我们的专业团队随时为您提供帮助。From One Engineer to Another®不仅是我们的一句口号,更是我们致力于提供卓越服务的承诺。只要您需要,我们随时待命。让我们联系吧!

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