Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, will present at the Electronic Components and Technology Conference (ECTC) May 26-29 in San Diego, Calif.
Dr. Lee's presentation, Achieving Low-Porosity Sintering of Nano-Ag Paste via a Pressureless Process, reviews the use of a newly-developed nano-Ag paste that allows for a pressureless sintered die-attach process. This process creates sintered joints that exhibit very low porosity, high joint shear strength, and very good electrical and thermal conductivity.
Dr. Lee is a world-renowned soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.
ECTC is a premier international event that brings together the best in packaging, component, and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the Components, Packaging, and Manufacturing Technology (CPMT) Society of the IEEE.
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持体系，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
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