乡亲们
SMTAI 一直都是一个很棒的会议。这是我第二喜欢的地方、 伊利诺伊州罗斯蒙特.(迪斯尼世界是最棒的）。 好论文但也有 专业发展课程.
我将与共同作者 Wisdom Qu 和 Chris Nash 一起 发表题为 "大尺寸服务器集成电路翘曲和变形引起的焊接挑战 "的论文。 这篇论文重点介绍了Durafuse®LT，并展示了它如何最大限度地减少 BGA 翘曲故障模式，如枕头内翘 (HiP) 缺陷。
See also these other papers by my Indium Corporation colleagues:
- "Effects of Dynamic Warpage on the Solder Joints of Large Plastic Ball-Grid Arrays Assembled with LTS" by Francis Mutuku, Hongwen Zhang, Huaguang Wang, and Tyler Richmond, Indium Corporation.
- "Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components" by Ravi Parthasarathy, M.S.Ch.E., ZESTRON Corporation; Patrick Lawrence, ITW EAE; Evan Griffith, Indium Corporation.
- "Fluxless Reflow Technology for Combination Fine-Pitch and SMT-Level Component Attach" by Evan Griffith, Indium Corporation;David Heller, Xike Zhao, and Phil Lehrer, Heller Industries.
- "Supercooled Solder Pastes in Low Temperature Attach Applications" by Yifan Wu, Ph.D., Ian Tevis, Radhika Jadhav, Indium Corporation.
希望能在那里见到你！
干杯，
Ron 博士
