How to Land That Job in an Interview
Interviewing for a job can be a stressful experience. After interviewing more than 300 people for jobs, and going through a few interviews myself, I h...
Dr. Ron Lasky
“Statistically Significant” vs “Practically Significant”
Folks, When following the elections last fall, we often heard that a certain poll either was or was not statistically significant. As an example, cand...
Use the Risk Priority Number (FMEA) when Making Risk Decisions In Electronics Soldering
Folks, The risk priority number (RPN) of failure modes an effects analysis (FMEA) is a useful tool to help make decisions relating to risk. It is defi...
Is a Difference in a Metric Practically Significant if it is Statistically Significant?
Folks, With the advent of modern imaging devices it is now possible to measure the transfer efficiency (TE) of thousands of stencil prints. This situa...
Calculating Confidence Intervals of Cpk in Stencil Printing
In stencil printing, the basic foundation is transfer efficiency. About two-thirds of all end-of-line defects can be traced back to the stencil printi...
Calculating Oddly-Shaped Aperture Area Ratios
How to calculate the area ratio of unusually shaped apertures, such as the elongated D-shape. ...
Exploring the Wet Gold Technique to Measure Precious Metal Content
What is the wet gold technique? How does it work? ...
Intermetallic Growth Rate is Strongly Temperature Dependent
I discuss that, though IMCs are not that brittle, it is wise to limit their growth....
Intermetallics and Kirkendall Voids Continue to Grow at Room Temperature
Kirkendall voids form when one metal diffuses more rapidly into another metal than vice versa....
Intermetallics: The Miracle of Soldering
New research suggests that solder joint failure modes are in the interfaces between the intermetallics and the solder, copper, or the intermetallic co...