Intermetallics and Kirkendall Voids Continue to Grow at Room Temperature
Kirkendall voids form when one metal diffuses more rapidly into another metal than vice versa....
Dr. Ron Lasky
Intermetallics: The Miracle of Soldering
New research suggests that solder joint failure modes are in the interfaces between the intermetallics and the solder, copper, or the intermetallic co...
Using C Charts for Different Sized Data Sets
C Charts are control charts used to track attribute data. Learn more here....
Is the Robot Apocalypse Upon Us?
Recall that quite a few horse manure shovelers were displace by the introduction of the automobile, and that numerous wood choppers had to retool with...
Will Robots Soon Take Jobs Away?
Some say fully autonomous vehicles will not arrive until 2045 at the earliest. Let's explore....
Cpk is Still King in Evaluating an SMT Solder Paste Printing Process
To evaluate an SMT stencil printing process you want to know its precision and accuracy. ...
SMT Stencil Design: Formula for Area Ratio of Elongated D
Learn how to calculate the area ratio of an elongated D stencil aperture....
Autonomous Automobiles: The Ultimate Electrical Reliability Challenge
Truly autonomous vehicles will not arrive for decades. Learn why....
The Importance of Tech Services in Electronics Assembly
Electronics assembly engineers derive tremendous value from tech service engineers. Learn how....
Why Solder Paste is Not a Commodity: Properties that Make a Superior Solder Paste
Solder paste is not a commodity, and its critical to know exactly why....
RoHS Ten Years Later: The Transition to Lead-Free Electronics Assembly
RoHS affects every one of us. Learn more....