Posted On: August 31st, 2022 | By: Evan Griffith

Trade Show Travels June 2022

Where has the semiconductor team been traveling to this summer?...

Posted On: February 8th, 2022 | By: Evan Griffith

APEX 2022: The Return of In-Person Trade Shows and Live@APEX

With the in-person return of the APEX trade show, Product Specialist Evan Griffith takes some time to reflect on his experience there as an exhibitor ...

Posted On: October 12th, 2021 | By: Evan Griffith

Miniaturization in LED Technology: MicroLEDs

LEDs are getting smaller, how do Indium Corporation's materials meet the manufacturing challenges of these products? Here we'll take a look at...

Posted On: October 11th, 2021 | By: Evan Griffith

Miniaturization in LED Technology: MiniLEDs

LEDs are getting smaller, how do Indium Corporation's materials meet the assembly challenges of these products. First, we'll take a look at Mi...

Posted On: October 7th, 2021 | By: Evan Griffith

SiP Printing 101 Webinar Follow-Up

Recently, I hosted a webinar for Stencil Printing for System in Package Applications. I wanted to take some time to offer a better explanation on impo...

Posted On: August 21st, 2021 | By: Evan Griffith

SiP Printing 101 Webinar Preview: Stencil Technology

Stencil technology has evolved throughout the years, and System-in-Package solder pastes require specific stencil manufacturing processes and novel te...

Posted On: August 20th, 2021 | By: Evan Griffith

SiP Printing 101 Webinar Preview: Solder Paste Inspection

Just as important in the solder paste printing process is solder paste inspection; how do you know if your printer is operating optimally if your SPI ...

Posted On: August 19th, 2021 | By: Evan Griffith

SiP Printing 101 Webinar Preview: Water Soluble vs. No-Clean Pastes

Choosing the correct solder paste formulation is critical for System-in-Package assembly. Indium Corporation's SiPaste® solder pastes offer a ...

Posted On: July 19th, 2021 | By: Evan Griffith

Common Ball Grid Array Failures and How to Avoid Them

The BGA ball-mount process may seem uninteresting and trivial at first glance. However, the soldering steps are complex and can lead to problematic fa...

Posted On: January 13th, 2021 | By: Evan Griffith

WS-446HF Wetting: No Substrate Is Too Tough

There are many different substrates that are used in the electronics industry, and some are more challenging to solder than others. Indium Corporation...

Posted On: January 12th, 2021 | By: Evan Griffith

How Does the Rheology of WS-446HF Enable One-Step Cleaning?

The rheology of a flux is very important with respect to the applications of a flux. WS-446HF has a stable rheology which makes it a good choice for b...