SiP Printing 101 Webinar Preview: Stencil Technology
Stencil technology has evolved throughout the years, and System-in-Package solder pastes require specific stencil manufacturing processes and novel te...
Evan Griffith's Blog
SiP Printing 101 Webinar Preview: Solder Paste Inspection
Just as important in the solder paste printing process is solder paste inspection; how do you know if your printer is operating optimally if your SPI ...
SiP Printing 101 Webinar Preview: Water Soluble vs. No-Clean Pastes
Choosing the correct solder paste formulation is critical for System-in-Package assembly. Indium Corporation's SiPaste® solder pastes offer a ...
Common Ball Grid Array Failures and How to Avoid Them
The BGA ball-mount process may seem uninteresting and trivial at first glance. However, the soldering steps are complex and can lead to problematic fa...
WS-446HF Wetting: No Substrate Is Too Tough
There are many different substrates that are used in the electronics industry, and some are more challenging to solder than others. Indium Corporation...
How Does the Rheology of WS-446HF Enable One-Step Cleaning?
The rheology of a flux is very important with respect to the applications of a flux. WS-446HF has a stable rheology which makes it a good choice for b...
WS-446HF: A One-Step Cleaning Flux
Indium Corporation’s water-soluble flux, WS-446HF, is designed to eliminate non-value-added process costs of prefluxing steps, turning “tw...
Indium Corporation: A New Hire's Perspective
The fact that every positive thing I heard about Indium Corporation's commitment to its employees was apparent within the first week of my employm...