Starvation Voids: When too little (paste) becomes too much (voiding)
Diving deeper into exploring the types of voids and how they occur, some important interactions between material and process variables appear....
Indium Corporation®'s Blog
Selecting the Right Packaging for Pure Indium Preforms
Indium metal preforms need specialized packaging to ensure they arrive at your facility safetly and securely. Let us help you choose just the right pa...
Why QuickSinter®? Let’s see the difference between Soldering and Sintering
Dr. McDonough discusses some of the benefits of QuickSinter® including its ability to handle high-temperature operating life without breaking...
Specifying Flux for Pure Indium Preforms
Jim Hisert enlists Meagan Sloan, Technical Support Engineer to recommend a flux for his indium preform application. ...
Now Available: Liquid Metal for Prototyping
Great news! Liquid metal for prototyping, low-volume applications, or even overclocking is more accessible that ever before....
Chemistry: Not Just a One Way Track
My indirect route to finding out what I really love to do - chemistry and engineering. Use as many resources as you can to help you find your way....
Durafuse® LT - Low-Temperature Reflow
Durafuse® LT gives us even more options for low-temperature solder reflow, but thankfully just using consistent terminology can go a long way...
Durafuse® LT - A New Relationship with Liquidus
Durafuse® LT is a low-temperature solder with two different liquidus temperatures - one lower and one higher than the the peak reflow tempera...
Durafuse® LT - Drop-shock
Low temperature solder Durafuse® LT's drop-shock test is two orders of magnitude better than the drop shock test of a BiSnAg alloy....
Indium Preform Order Quantity
Since pure indium preforms are so soft, making thousands of parts requires different processing and packaging methods than manufacturing jus...
Indalloy® 292 - High Reliability Alloy
Indium Corporation's new high reliability solder alloy Indalloy® 292 is focused on exceeding the thermal cycling requirements for automotive a...