Soldering Basics
A couple of my colleagues, Jim Hisert and Andy Mackie recently published an article about the use of solders in chip packaging. The article begins wit...
Solder Alloys
Ancient Text
I love to read white papers from the 1930’s on indium (the element). People had no idea what interesting properties they would discover from wor...
Do LEDs need pure metal thermal interface materials?
Simply stated, YES. In effort to stay on top of industry technology I spend as much time as I can afford attempting to learn about the current thermal...
Solder Paste Squeegee Hang-Up
I just returned from a business trip and encountered a common problem, solder paste squeegee hang up. But like nearly all of the cases I’ve seen...
Package-on-Package Paste Leveling (1/5)
This is the first of a series of entries dealing with tips for Package-on-Package assembly. A logical place to begin is material deposition. It is imp...
Au/Sn - One of a Kind
For those of us who recommend solder alloys, Au/Sn holds a place in our hearts. In many cases it is the #1 solder for an application (if......
Dispensing Die-Attach Solder Paste
The picture shows a “Dispensing Component Kit”. I find this is extremely helpful in quickly verifying your powder/needle combination. This...
Synchronize Your Solar Cell
Many people do not consider either semiconductors or solar cells as having any moving parts. But this is not completely true. Indeed, every solar cell...
Intel Achieves Lead-Free Flip Chip Connections in 45 nm Technology
Folks, Intel announced that they now produce lead-free flip chip solder joints in their 45 nm technology. You will recall that flip chip solder joints...
Concerns for the Tin Supply
Lisme writes, Hi Dr. Lasky, As tin is the major material used in lead free soldering, and it’s source is decreasing each year, is there any pred...
Indium Oxide Layer
There are multiple types of thermal interface materials available, but due to its high thermal conductivity, compressibility, and ease of application,...
Be Data Driven
Folks, I was recently asked to give a presentation and audit an assembly line regarding minimizing “tombstoning” of passives at a major el...