SAC305 May Not Become De-Facto Standard
Folks, About two years ago it appeared that SAC305 (3.0% silver, 0.5% Cu, the balance tin) was becoming the de-facto standard for Pb-Free assembly. Wi...
Folks, About two years ago it appeared that SAC305 (3.0% silver, 0.5% Cu, the balance tin) was becoming the de-facto standard for Pb-Free assembly. Wi...
There is a significant push in the electronics industry to produce “halogen-free” products in order to be more environmentally friendly. ...
Please don’t be fooled by misconceptions like the following: 1) Lead is bad 2) Soldering is simple 3) Soldering is complex 4) Changing a S...
Why doesn’t my solder flow? The most common issue preventing good solder wetting on a substrate is oxidation. All metals are prone to some level...
Soft solders are used instead of hard solders in applications were there are large coefficient of thermal expansion mismatches between semiconductor d...
This question was posed to me while introducing a family member to the world of Engineered Solders this past weekend. While I was still reeling from t...
Spheres are a great solder form for prototype work. (Pictured here are a range of sphere sizes, BGA size compared to flip chip size.) Solder spheres...
The shape of your solder joint below a flip-chip or BGA is controlled by the surface tension of the alloy, the activity of flux used, the tension or c...
With the Strategies in Light show just behind us, I thought it a good time to discuss a little further the use of metal thermal interface materials......
Do you have a 2’ x 3’ area on the wall of your office or cubical for the latest new and improved Indium Corporation Wall Chart? a......
A couple of my colleagues, Jim Hisert and Andy Mackie recently published an article about the use of solders in chip packaging. The article begins wit...
I love to read white papers from the 1930’s on indium (the element). People had no idea what interesting properties they would discover from wor...