A Method to Attach Indium Interfaces over Large Surface Areas
In a past entry, I discussed the characteristic formation of surface oxides on indium and the various methods by which to remove these to achieve a so...
In a past entry, I discussed the characteristic formation of surface oxides on indium and the various methods by which to remove these to achieve a so...
This is the first of a series of entries dealing with tips for Package-on-Package assembly. A logical place to begin is material deposition. It is imp...
Folks, My colleagues at Indium Corp tell me that some major companies are now starting to specify maximum halogen levels in solder paste flux residues...
For those of us who recommend solder alloys, Au/Sn holds a place in our hearts. In many cases it is the #1 solder for an application (if......
Optimizing the amount of solder paste transferred during component dipping for Package-on-Package assembly should be a goal for your PoP process. Whil...
Package-on-Package solder paste is a relatively new concept in the solder industry. With limited material sets, we need to be able to capitalize on th...
The picture shows a “Dispensing Component Kit”. I find this is extremely helpful in quickly verifying your powder/needle combination. This...
We received a call today from a customer that had tested the halide content of their board and reflowed solder paste, without components, using Ion Ch...
Package-on-Package processing steps can create delays in getting to the reflow process. If you are new to stacking components, consider the mainstream...
Many people do not consider either semiconductors or solar cells as having any moving parts. But this is not completely true. Indeed, every solar cell...
We might as well add solder to the list of things that will still be around after a nuclear blast. I think everyone that has been in a......
Folks, A few days ago, I promised more from Tim Jensen on Halide-free soldering. Here it is: DR: There is a significant push in the electronics indust...