Bringing Solder Paste Reliability to E-Mobility
Solder paste is enabling the complex electronic systems of next generation of vehicles - from power inverters and battery management to infotainment...
Solder Paste
Response-to-Pause: A Critical Solder Paste Parameter
Folks, Solder paste is arguably the most highly engineered material in electronic assembly. It has many properties that must be favorable for its good...
Stuck in a Slump? Factors Impacting Solder Paste Slump Susceptibility.
Certain solder pastes are more susceptible to experiencing slump than others due to both chemical properties and experimentation processes. Risk facto...
Square vs. Circular Apertures and the Five Ball Rule Revisited
Folks, I recently posted that circular apertures deliver much less solder past than square apertures. One of the obvious reasons is that a circle of d...
The Importance of an Oxygen Barrier In Solder Paste Flux
Folks, Solder paste is arguably one of the most highly engineered materials. What is usually called solder paste “flux” is a combination o...
The Pin-in-Paste Process with Donut-Shaped Preforms
Folks, some years ago I created a software tool, StencilCoach™, to calculate the stencil parameters to provide for an adequate amount of so...
Enhanced SIR testing for Reliability
SIR testing has been around for a while. Why? And why might we want to use tests that are even more challenging than the current J-STD-004B?...
When Life Gives You Lumens, Make LED Paste!
AuLTRA™ 3.2 and AuLTRA™ 5.1 are air or nitrogen reflow AuSn solder pastes specially formulated for higher processing temperatures and asse...
Why Square Apertures Provide More Solder Paste than Circular Apertures
Folks, When comparing the volume of solder paste provided by a circular versus square aperture, consider that if the side of the square is D and the d...
Join Me at SMTA's PanPac 2022 - January 31 to February 3
Folks, I will be presenting three papers at PanPac 2022. They are: 1. Low Melt High Remelt Solder Paste, co-authored with Claire Hotvedt of Indium Cor...
SiP Printing 101 Webinar Follow-Up
Recently, I hosted a webinar for Stencil Printing for System in Package Applications. I wanted to take some time to offer a better explanation on impo...
SiP Printing 101 Webinar Preview: Stencil Technology
Stencil technology has evolved throughout the years, and System-in-Package solder pastes require specific stencil manufacturing processes and novel te...