Durafuse® LT - Drop-shock
Low temperature solder Durafuse® LT's drop-shock test is two orders of magnitude better than the drop shock test of a BiSnAg alloy....
Solder Paste
Not all fluxes and solder pastes are created equal!
The different flux and solder paste formulations mean that some products will have different material lifetimes than others. Understanding the lifetim...
Durafuse® LT - New Mixed Low Temperature Solder Technology!
New Durafuse® LT is a novel mixed alloy system designed to combine low temperature solder reflow with drop-shock performance similar to or be...
Why is AuSn powder size important for solder paste application?
Today's electronics continue to get smaller and smaller, so the traditional type 3 (-200/+325) mesh size might be too large for new scale-ups. Thi...
How does AuSn alloy and flux impact the reliability of solder paste?
When looking at the reliability of AuSn solder paste, you need to take a couple of things into consideration, the post reflow alloy composition (off-e...
Indium Corporation Manufacturing Facilities Earn IATF-16949:2016
I am proud to announce that five of Indium Corporation's manufacturing facilities have earned IATF-16949:2016 certificates....
LIVE@APEX Solder Fortification® Preforms
LIVE@APEX features Solder Fortification® Preforms. This blog posts tells you how they can be used to resolve assembly issues such as solder starva...
LIVE@APEX part 2 - Solder Paste
See what equipment manufacturers use Indium8.9HF to demonstrate their equipment at APEX 2019....
Reflow Profiling for Next Generation Solder Paste Alloys - SMTAi
This post discusses reflow profiling and the two different profiles that are commonly used in the SMT industry....
Stages of a Reflow Profile: Part IV
The cool down rate of a profile can affect the grain structure of a solder joint, thus determining the mechanical strength of the solder joint....
Indium Mailbag – Solder Paste Shelf Life
Today's Indium Mailbag question asks about the storage of indium-contained solder paste at a temperture well below the recommended temperature of ...
Stages of a Reflow Profile: Part III
What is the ideal time-above liquidus during solder reflow? Too long or too short can cause dewetting and charring, or not allow the intermetalli...